HT Micron unveils IoT chip at LoRaWan World Expo

  • July 7, 2022
  • Steve Rogerson

Brazilian firm HT Micron introduced a LoRa and Bluetooth IoT chip at this week’s LoRaWan World Expo in Paris.

The iMCP HTLRBL32L is a system-in-package of 13 by 13 by 1.1mm to enable easy integration and prototyping of long- and short-range IoT products.

“LoRaWan connectivity is being adopted worldwide in all segments of the internet of things,” said Edelweis Ritt from HT Micron. “We see exciting use cases and massive deployments in smart metering, asset tracking, condition monitoring, Industry 4.0, smart cities and many more. Bluetooth is already widely used for short-range communications. Therefore, the combination of both LoRa and Bluetooth in one single SiP brings huge benefits to IoT developers and integrators.”

HT Micron makes semiconductor products and was exhibiting at the LoRaWan World Expo for the first time.

“The vibrant LoRa Alliance ecosystem brings together companies from the IoT value chain and complementary technologies,” said Julio Soccol, HT Micron sales and marketing manager. “We are excited about the LoRaWan World Expo, meeting many new partners and customers and discussing use cases and opportunities.”

Visitors were able to see the iMCP HTLRBL32L SiP in action. While ready to send user data in multi-region LoRaWan applications, the Bluetooth connectivity enables easy device commissioning, wireless firmware update and mesh networking capabilities. The full product brief will be released on HT Micron’s Github page.

Samples are expected in September 2022. Orders for mass production can be placed starting from this quarter.

An additional highlight at the show was the firm’s IPv6 over LoRaWan demo in collaboration with Acklio at the demo pod area. The LoRa Alliance has recently released its TS010 technical specification on the IPv6 adaptation layer, which facilitates the development of secure and interoperable applications over LoRaWan. Now protocol data from IP-based products are made transportable over LoRaWan using the SCHC header compression and fragmentation mechanism standardised by the IETF. The IPv6 over LoRaWan demo featured Acklio’s software suite and HT Micron’s custom embedded firmware package for SCHC which is already available for the iMCP HTLRBL32L.

“HT Micron is very proud to offer the SiP with LoRa and Bluetooth made in Brazil to IoT developers, device makers and integrators worldwide,” said Ritt. “The iMCP HTLRBR32L with accessible MCU and full range of peripheral interfaces will be appreciated for its high configurability and flexibility. Our goal is to simplify integration and accelerate the development of IoT as much as possible. This saves customer NRE and valuable time to market on the path to massive IoT deployments.”

HT Micron’s portfolio includes memories for computers, mobile phones and smart TVs, as well as system-in-package connectivity for the IoT. The company has as main shareholder the South Korean group Hana Micron, and is based in the city of São Leopoldo in Brazil.