German embedded technology company Congatec has introduced 20 computers-on-module (CoMs) following the launch of Intel’s 11th-generation Core processor for the IoT.

Featuring 11th-generation Intel Core vPro, Xeon W-11000E and Celeron processors, the modules target IoT gateway and edge computing applications.

Built on Intel’s 10nm SuperFin technology in a two-package design with dedicated CPU and platform controller hub (PCH), the flagship Com-HPC client and Com Express type-six modules have a bandwidth benchmark of up to 20 PCIe gen-4.0 lanes for massive connected real-time IIoT gateway and intelligent edge computing workloads.

To process such massive workloads, the modules boast up to 128Gbyte DDR4 SO‑DIMM RAM, integrated AI accelerators and up to eight CPU cores that achieve up to 65% gain in multi-thread performance and up to 32% gain in single-thread performance.

Moreover, visualisation, auditory and graphics intensive workloads are enabled with a boost of up to 70% compared with predecessors, enhancing performance for these immersive experiences.

Flagship applications that directly benefit from these GPU enhancements can be found in surgery, medical imaging and e-health edge applications as the platform supports 8K HDR videos for diagnostics. Combined with the platform’s AI capabilities and the Intel OpenVino toolkit, doctors can gain access and insights into deep-learning based diagnostic data.

The integrated Intel UHD graphics also support up to four 4K displays in parallel. In addition, they can process and analyse up to 40 HD 1080p, 30fps video streams in parallel for 360-degree views in all directions.

These AI infused massive vision capabilities are also important for other markets, including factory automation, machine vision for quality inspection in manufacturing, safe spaces and cities, as well as collaborative robotics and autonomous vehicles in logistics, agriculture, construction and public transport.

AI and deep learning inference algorithms can seamlessly run either massively parallel on the integrated GPU, or on the CPU with a built-in Intel deep learning boost that combines three instructions into one, accelerating inference processing and situational awareness.

The client and platforms have integrated safety functions that are important for the fail-safe operation of many mobile vehicles and robots, as well as stationary machinery. As real-time support is mandatory for such applications, the modules can run real-time operating systems such as real-time Linux and Wind River VxWorks, and provide native support from Real-Time Systems’ hypervisor technology, which is also supported by Intel.

The result is a rounded ecosystem package with support.

Further real-time capabilities include Intel Time Coordinated Computing and Time Sensitive Networking (TSN) for real-time connected IIoT and Industry 4.0 gateways and edge computing devices. Security features help protect systems against attacks to make these platforms candidates for all types of critical applications in factories and utilities.

The Conga-HPC/cTLH Com-HPC client size B 120 by 120mm modules, as well as the Conga-TS570 Com Express Basic type-six125 by 95mm modules  will be available with scalable 11th-generation Intel Core, Xeon and Celeron processors, with selected variants even for extreme temperatures from -40 to +85˚C.

Both form factors support up to 128Gbyte DDR4 SO-DIMM memory with 3200MT/s and optional ECC. To connect peripherals with massive bandwidth, the Com-HPC modules support 20 PCIe gen-four lanes (x16 and x4), and the Com Express versions support 16 PCIe lanes. In addition, designers can leverage 20 PCIe gen-three lanes with Com-HPC and eight PCIe gen-three lanes on Com Express.

To support fast NVMe SSD, the Com-HPC provides four PCIe interfaces to the carrier board. The Com Express board has NVMe SSD even onboard for optimum use of all native gen-four lanes supported by the processor. Further storage media can be connected via two Sata gen-three on Com-HPC, and four Sata on Com Express.

Where the Com-HPC module offers two USB 4.0, two USB 3.2 gen-two, and eight USB 2.0, the Com Express module has four USB 3.2 gen-two and eight USB 2.0 in compliance to the Picmg specification.

For networking, the Com-HPC module has two 2.5GbE, whereas the Com Express module executes one GbE, with both supporting TSN. Sound is provided via I²S and SoundWire in the Com-HPC version, and HDA on the Com Express modules.

Board support packages are provided for all leading real-time operating systems, including hypervisor support from Real-Time Systems as well as Linux, Windows and Android.