The US national institute for Smart Manufacturing, CESMII, is incorporating ThinkIQ’s technology into its Smart Manufacturing Innovation Platform. ThinkIQ’s technology will become the underlying framework for the CESMII SMIP platform. The SMIP platform is designed to accelerate the adoption of Industry 4.0 technologies by US manufacturers of every size.

The CESMII SMIP aims to drive adoption of Smart Manufacturing more broadly in the United States through open interfaces, and democratised information models to make it easier, faster and cheaper than traditional closed solutions available to the manufacturing community.

The tie up with CESMII will benefit ThinkIQ customers, who will have access to smart manufacturing applications developed and integrated with the SMIP and CESMII’s further development and expansion of Smart Manufacturing Profiles. According to ThinkIQ, this will enable a simpler, lower cost and more effective implementation of smart manufacturing solutions to solve manufacturing problems as offered in CESMII’s Smart Manufacturing Marketplace.

“We are proud to have been chosen by CESMII as a core technology partner to drive adoption of Smart Manufacturing by manufacturers of all shapes and sizes via the SMIP,” said Doug Lawson, CEO of ThinkIQ. “This serves as validation to our customers who have put their confidence behind the industry leading Smart Manufacturing platform.”

“The Smart Manufacturing Innovation Platform is designed to help every manufacturer capitalise on the advances and power of Industry 4.0 to increase competitiveness and profitability,” said John Dyck, CEO of CESMII. “Partnering with ThinkIQ provides the SMIP with the foundation that is intended to be a standard across the manufacturing industry.”