- ABOUT IMC
- IoT LIBRARY
- RFP PROGRAMME
USI reveals Bluetooth 5.0 antenna-on-package module
- August 18, 2021
- Steve Rogerson
Chinese company Universal Scientific Industrial (USI) has launched a dual-core Bluetooth 5.0 antenna-on-package (AoP) module for compact IoT devices.
The ubiquity of IoT devices has proportionally increased the need for wireless and seamless connections to the internet. In line with this trend, USI has launched its WM-BZ-ST-55 dual-core Bluetooth 5.0 AoP module that capitalises on its proprietary heterogeneous integration and miniaturisation technology.
The module is an eco-friendly product with the energy-saving feature of low power consumption. The Bluetooth module is for applications such as remote sensors, wearable trackers, building automation controllers, computer peripherals, UAVs and other IoT devices.
Measuring 7.2 by 9.3 by 0.96mm, the module uses ST Microelectronics’ STM32L4 Arm Cortex-M4 MCU with the Cortex-M0 plus dedicated kernel-managed RF chip. This freestanding compact module is packaged with partial metal sputtering shielding, includes STM’s STM32WB55 RF SoC that supports Bluetooth LE 5.0, Zigbee and Thread wireless connection, incorporating Bluetooth LE and integrated with a 2.4GHz antenna.
“Traditional Bluetooth modules were often excessively large in size or paired with external antennas due to the difficulty in reducing the antenna size,” said Kevin Lan, general manager at USI. “By employing USI’s antenna-on-package technology and selected conformal shielding process, we can integrate the Bluetooth with the antenna and reduce the size smaller than a single IC in a BGA package. Furthermore, we design the WM-BZ-ST-55 module with a built-in Cortex-M4 microcontroller that not only offers cost savings for customers’ chip designs, it can also be incorporated in a wide range of space-constrained IoT devices.”
USI used computer-aided simulation software from the beginning of the module design to simulate the antenna efficiency, radiation pattern and gain. Completing simulation at the initial design stage helped streamline the design process, shortening the design cycle.
The module operates between -40 and +85˚C. The company is applying for international certification from communication regulators, including the US FCC, EU CE and Canadian IC.
Shanghai-based USI specialises in electronic design and manufacturing as well as system-in-package modules. It provides design, manufacturing, miniaturisation and industrial software and hardware, and material procurement, logistics and maintenance services. The company has 27 sales, production and service locations across America, Europe, Asia and Africa, and offers products for wireless communication, computer and storage, consumer, industrial, medical and automotive electronics. USI is a subsidiary of ASE Technology Holding, a Taiwanese provider of semiconductor manufacturing services in assembly and test.