Telit Cinterion announced at this week’s Mobile World Congress (MWC) in Barcelona the FE990B34/40 LGA family of modules, powered by the Snapdragon X72 5G modem-RF system from Qualcomm.

The modules feature a high-power quad-core CPU to improve computing power as well as interfaces for flexibility when integrating peripherals, signifying a leap forward in 5G connectivity. For more information, see www.telit.com/modules-overview/cellular-5g.

Featuring the Snapdragon X72 chipset, designed to drive the next phase of 5G evolution enabled by 3GPP Release 17, the FE990B34/40 LGA family (www.telit.com/devices/fe990bxx) is said to redefine connectivity on 5G NR, LTE and WCDMA, empowering developers to create customer premise equipment (CPE), routers and gateways.

Available in regional variants catering to either North America or the rest of the world, the modules offer support for two or three component carriers, providing flexibility and compatibility while meeting diverse market requirements.

With a quad-core Arm Cortex A55 at 2.2GHz baseband processor delivering processing capabilities, and running the OpenWRT operating system with networking features, the modules allow users to integrate their own software without the need for an external processor, while various interfaces enable direct connections to up to three wifi transceivers and two Ethernet chips, providing flexibility to integrate peripherals seamlessly.

The modules also feature 5G sub-6GHz technology with gigabit LTE and WCDMA support, along with a multi-constellation GNSS receiver.

For ruggedised applications, these modules offer a compact footprint and rich features, making them suitable for high-performance enterprise and industrial applications, including indoor and outdoor fixed wireless access (FWA), video streaming and surveillance devices, and mobile and industrial routers and gateways.

“Today marks the next chapter in our rich history of accelerating next-generation technology adoption with leaders like Telit Cinterion,” said Gautam Sheoran, vice president at Qualcomm. “The Snapdragon X72 5G modem-RF system delivers breakthrough 5G performance to the new FE990B34/40 LGA module family.”

Manish Watwani, chief product officer at Telit Cinterion, added: “The FE990B34/40 LGA family of modules, backed by Qualcomm’s advanced 5G X72 and X75 chipset, is emblematic of the tremendous strides being made in 5G connectivity. With unparalleled processing power and versatile interfaces, these new modules embody our dedication to pushing the boundaries of innovation in IoT while empowering developers to create ground-breaking 5G-enabled devices.”