Telit modules based on Snapdragon RF modems

  • March 2, 2022
  • Steve Rogerson

Telit has introduced its 5G M.2 worldwide module SKUs powered by the fourth-generation Snapdragon X65 and X62 modem-RF systems.

The 3GPP release-16 products should help device OEMs and systems integrators support bandwidth-intensive, mission-critical and latency-sensitive applications such as smart manufacturing, Industry 4.0, telemedicine, 4K and 8K streaming video, and private 5G networks.

The industrial 5G M.2 modules are available with LTE and WCDMA fallback:

  • FN990A28: Sub-6: 120MHz, 2CC CA
  • FN990A40: Sub-6: 200MHz, 3CC CA

Release 16 is the latest version of the 5G standard. It includes features such as reliable low-latency communication to enable a wide variety of use cases for industrial IoT, smart manufacturing, robotics, industrial gateways, fixed wireless access, SD-WAN, 4K and 8K video streaming, extended reality gaming, ehealth, private 5G networks and more.

The Snapdragon X65 and X62 are 3GPP release-16 5G modem-RF products and said to be the world’s first announced 10Gbit 5G systems. Snapdragon X65 supports mm-wave and sub-6GHz spectrum aggregation, as well as support for mm-wave in standalone mode and FDD+TDD, TDD+TDD and FDD+FDD in sub-6GHz flexible carrier aggregation combinations. They also have an integrated L1 and L5 dual-frequency GNSS for applications that require precision location.

“We’re pleased to see Telit utilising the Snapdragon X65 and X62 modem-RF systems as the foundation for Telit’s new series of 5G data cards,” said Gautam Sheoran, vice president at Qualcomm. “With premium speed, reliability and features, these will continue to support the ecosystem in proliferating the 5G opportunity beyond smartphones.”

Telit has an existing portfolio of industrial grade 5G modules with regulatory and mobile network operator certifications, which provides OEMs, system integrators and end users with added independent verification that their devices will perform as expected on all major mobile operator networks worldwide.

In addition to supporting Telit OneEdge, which simplifies design, deployment and management of IoT products, the M.2 modules also support the Telit IoT AppZone, which simplifies product design with easy-to-use tools and APIs. AppZone also reduces bill-of-materials costs and design complexity by embedding application code in the module, eliminating the need for a microcontroller.

“Telit and Qualcomm Technologies have a long history of working together to transform brand-new standards into commercial products, including the award-wining Telit FN980 series introduced in 2019, the world’s first data card featuring the Snapdragon X55 5G modem-RF system,” said Manish Watwani, chief marketing and product officer at Telit. “As the foundation for our new series of 5G data cards, the Snapdragon X65 and X62 are a natural evolution and enable device OEMs, systems designers and end users to immediately take advantage of 3GPP release 16’s game-changing, future-proofing capabilities.”

Customer samples will be available this quarter with mass production in the summer.