Silicon Labs has introduced two wireless SoC families built using the 22nm process node.

The SiXG301 and SiXG302 are the first products of its Series 3 portfolio and represent a leap forward in compute power, integration, security and energy efficiency, addressing the demands of line-powered and battery-powered IoT devices.

As smart devices grow more sophisticated and compact, the need for powerful, secure and highly integrated wireless has never been greater. The Series 3 SoCs deliver on this with processing capabilities, flexible memory options, security and streamlined external component integration.

The Series 1, 2 and 3 platforms will continue to complement one another in the market and address the full breadth of IoT applications.

Purpose-built for line-powered smart devices, the SiXG301 includes an integrated LED pre-driver and is suitable for LED lighting and smart home products, supporting Bluetooth, Zigbee and Thread with support for Matter. Built with high flash and RAM overhead of 4Mbyte and 512kbyte, respectively, the SiXG301 helps future-proof designs as the requirements for Matter and other demanding IoT applications continue to grow.

This SoC enables concurrent multi-protocol operation for Zigbee, Bluetooth and Matter over Thread networks at the same time, which helps simplify manufacturing SKUs, reduce costs, save board space for additional device integrations, and improve consumer usability. Already in production with select customers, the SiXG301 is slated for general availability in Q3 2025.

Expanding Series 3 to battery-powered applications, the upcoming SiXG302 will deliver energy efficiency without sacrificing performance. It is designed to use 15µA/MHz active current, said to be 30% lower than competitive devices in its class. This makes it suitable for battery-powered wireless sensors and actuators for Matter and Bluetooth applications. It is planned for customer sampling in 2026.

“Smart devices are becoming more complex, and designers are challenged to pack greater functionality into smaller spaces while maintaining energy efficiency,” said Ross Sabolcik, senior vice president at Silicon Labs.

The families will initially include M devices for multiprotocol, the SiMG301 (www.silabs.com/wireless/zigbee/simg301-series-3-socs) and SiMG302, and B devices optimised for Bluetooth LE communications, the SiBG301 (www.silabs.com/wireless/bluetooth/sibg301-series-3-socs) and SiBG302.

By leveraging the 22nm process node for all Series 3 devices (www.silabs.com/wireless/series-3-wireless-platform), Silicon Labs is addressing the growing demand for more powerful and efficient far-edge devices across a wide range of IoT applications, from smart cities and industrial automation to healthcare, smart homes and beyond.

Headquartered in Austin, Texas, Silicon Labs (www.silabs.com) has operations in 16 countries and is a partner for innovations in the smart home, industrial IoT and smart cities markets.