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Rohm bright white LEDs suit IoT devices and drones
- April 28, 2021
- Steve Rogerson
Japanese electronics company Rohm has developed compact high luminous intensity white chip LEDs for applications requiring high brightness white light emission, such as IoT devices, drones and other battery equipped applications.
In recent years, high luminous intensity white LEDs have been being increasingly adopted to improve visibility in a range of applications in the consumer electronics and automotive sectors. At the same time, the emergence of applications that mount multiple LEDs in a small space – such as IoT devices and drones – require high density mounting. This makes it difficult to achieve high brightness in a compact footprint.
The CSL1104WB series achieves a luminous intensity of 2.0cd in a 1608 size (1.6 by 0.8mm = 1.28mm²), which was previously difficult to achieve. The result is the same luminosity as the current mainstream 3528 size PLCC package (3.5 by 2.8mm = 9.8mm²) but in an 87% smaller form factor.
Moreover, colour variation is improved, simplifying the colour adjustment process by ensuring accurate white colour chromaticity. This not only contributes to greater application space savings, but also improves design flexibility along with visibility through high density mounting of high luminosity LEDs, reducing development load considerably.
In addition, qualification under the automotive AEC-Q102 standard specifically developed for optical devices is planned, enabling a smooth application inside industrial equipment and automotive applications that are exposed to harsh environments.
Rohm says it is committed to expanding its line of 1608 size white chip LEDs further from low to high brightness, aiming to improve design flexibility while reducing development load by decreasing application height and simplifying product design.
Rohm Semiconductor is worth $3.3bn and has more than 22,000 employees. The company develops and manufactures products from SiC diodes and mosfets, analogue ICs such as gate drivers and power management ICs to power transistors and diodes to passive components. Production takes place in manufacturing plants in Japan, Korea, Malaysia, Thailand, Philippines and China.