Quectel used this week’s CES in Las Vegas for the official launch of its SP895BD-AP flagship smart module powered by the Qualcomm Dragonwing Q-8750 processor.

The module boasts enhanced graphics processing capabilities, visual imaging effects and edge computing performance, meeting the requirements of high-end devices such as video conferencing systems, UHD displays, image synthesis equipment, computing power boards, smart retail terminals and smart home appliances.

Powered by the Dragonwing Q-8750 built on a 3nm process, it features an eight-core Oryon CPU with a maximum frequency of 2×4.32GHz plus 6×3.53GHz. Compared with the previous series-eight chips, it achieves a 45% improvement in CPU performance and a 44% optimisation in energy efficiency. This ensures stable, high-performance output even in demanding scenarios such as multi-task concurrent processing and complex algorithm execution, while intelligently reducing power consumption to balance computing performance and energy efficiency.

In addition, the Adreno series-eight GPU achieves a 40% boost in both processing power and energy efficiency. Its tiled architecture enables better graphics and lifelike rendering, ensuring reliable performance for high-complexity tasks and UHD (8K/3D) displays.

“The demand for computing power and multimedia processing capabilities in terminal devices is experiencing explosive growth,” said Doron Zhang, COO at Quectel Wireless (www.quectel.com). “The SP895BD-AP smart module leverages the Dragonwing Q-8750 processor, delivering enhanced performance in CPU, GPU, edge computing and 8K multimedia processing capabilities. It provides a balance between computing power and energy efficiency, accelerating the digital and intelligent upgrading of the industry.”

The module supports 8K at 30fps video encoding and 8K at 60fps decoding, delivering a leap in bitrate handling and transmission efficiency. This combination enables low-latency transmission and high-fidelity UHD video restoration, meeting the demands of 4K and 8K displays, professional conferencing systems, and other high-performance applications.

In addition, the module has three built-in ISPs (image signal processors) that can simultaneously process three channels of 48MP at 30fps video input. A single camera supports up to 108Mpixel image capture, accurately capturing image details and meeting the needs of high-end imaging.

The module is available in an LGA package with a compact size, enabling adaptation to more product forms. In addition, it is equipped with peripheral interfaces including Mipi DSI, CSI, PCIe, USB, I²S, uart, I²C and SPI, which can meet various expansion needs for display, audio, sensing and communication, enhancing scenario adaptability and deployment flexibility in many IoT applications.

The module is compatible with Android 15 and Linux operating systems to cater to a broader industry ecosystem, lowering the technical threshold for cross-domain applications.