NTT Docomo and KDDI, two of Japan’s largest mobile operators, have completed interoperability testing of French cellular IoT connectivity firm Sequans Communications’ Monarch 2 GM02S module.

Monarch 2 GM02S is based on Sequans’ second-generation Monarch 2 platform, which is an LTE-M and NB-IoT chip designed to support massive IoT applications including meters, trackers, sensors and wearables. The module delivers low power consumption, support for integrated SIM (iUICC), and a single SKU RF front end that supports deployment in any band worldwide. It is backwards compatible with Sequans first generation Monarch platform.

“Our IoT customers will benefit from the maturity and ultra-low power consumption of Sequans’ Monarch 2 GM02S module,” said Yoshiki Fujima, general manager at NTT Docomo. “The module has powerful capabilities and it is a comprehensive IoT connectivity solution enabling device makers to launch new products quickly on our LTE-M network.”

Hiroshi Tsuji, general manager at KDDI, added: “Sequans’ Monarch 2 GM02S module is one of the most advanced cellular IoT connectivity solutions in the market today. It can be deployed in any band worldwide, ensuring success in IoT. We are pleased that Sequans’ Monarch 2 GM02S module has passed our certification tests and is ready to support the design and deployment of new IoT devices on our network.”

And Georges Karam, Sequans CEO, said: “Japan is one of the most exciting markets in the world for IoT and we are pleased that our Monarch 2 GM02S module can now support IoT developers and device makers in Japan. Japan has great expertise in IoT segments such as smart city, smart home, wearables and other IoT-related tech and we look forward to seeing many new Sequans-connected IoT devices launching on Japan’s mobile networks very soon. This new step is expanding the reach of Monarch 2 GM02S module already largely used in Europe and North America.”

• Sequans’ GSMA-compliant integrated SIM (iUICC) is now Common Criteria certified and available on the Monarch 2 LTE-M and NB-IoT chip. Integrated SIM, where the SIM is integrated directly into the chip, is virtually exempt from tampering, providing a security advantage for IoT applications in utilities, healthcare, banking or retail.

Beyond iUICC, Monarch 2 enables secured data ciphering and encryption leveraging the now-certified secure enclave using the GSMA standard IoT Safe or other options. Monarch 2 with integrated SIM also reduces power consumption, size and cost.

Sequans collaborated with Tiempo Secure, a provider of security IP for semiconductor design companies, and Kigen, a provider of the SIM operating system with remote SIM provisioning, to bring the full iSIM on its chip to market. Tiempo handled the certification work with CEA-LETI, where Monarch 2’s CC EAL5+ Common Criteria security rating was tested and proven. Kigen demonstrated Monarch 2’s iSIM capabilities using Kigen’s SIM OS with customers and operators. Monarch 2 with integrated SIM is sampling with select customers on tier-one operator networks in the USA and Europe.

Founded in 2003, Sequans is based in Paris, France, with offices in the USA, UK, Israel, Hong Kong, Singapore, Finland, Taiwan, South Korea and China.

• Sequans has announced a series of Cat 1 IoT modules based on its second-generation LTE Cat 1bis chip, Calliope 2. The modules are low-cost, low-power and IoT-optimised, and support VoLTE and throughput higher than LTE-M for applications including wearables and hearables with music streaming; smart city and smart home IoT devices such as security cameras, alarm panels and utility meters; and data aggregators that can require throughput up to several megabits per second. The modules are optimised to support regional variants covering North America, Japan and Europe.