Swiss firm U-Blox has launched an LTE Cat 1bis module featuring an embedded eSIM with Wireless Logic connectivity designed to improve the robustness, reliability and resilience of IoT applications.

The integral eSIM ensures flexible connectivity management and gives users the ability to switch to the best network in terms of coverage and cost.

Offering faster deployment and reliable connectivity regardless of geography, the Sara-R10001DE (www.u-blox.com/en/product/sara-r10001de) suits applications such as asset tracking, telematics, micro-mobility, solar technology, smart homes and cities, and points of sale.

It provides full LTE Cat 1bis band support and an eSIM with multi-IMSI technology and eUICC capability. The eSIM is already profiled with a series of Wireless Logic SIM profiles but can also be remotely profiled via OTA using remote SIM provisioning.

The multiple SIM profiles stored in the Wireless Logic eSIM allow the module to connect to the best network automatically. This gives confidence that the eSIM will maintain reliable connectivity by switching automatically to a different operator if any issues arise.

The embedded eSIM simplifies logistics because it reduces the time and effort involved in managing SIM procurement and eliminates the need to source companion components such as SIM holders.

“Our new module with inbuilt connectivity has been designed to offer the best user experience by making it simpler and quicker to achieve reliable connectivity while delivering cost efficiencies,” said Samuele Falcomer, product line manager at U-Blox. “Bundling can offer better financial outcomes than purchasing connectivity separately because customers do not need to buy a separate SIM, SIM holder and the related components to make it work. The Sara-R10001DE module is supplied with the connectivity already profiled, so customers only need just to activate it via the SIM management.”

Additional savings are possible because it lets users simplify logistics and reduce complexity. Bundling an IoT module with flexible connectivity means they can use a single SKU instead of having several SKUs with different SIM cards in the warehouse, simplifying stock itineraries and reducing storage requirements.

The embedded eSIM enhances robustness for reliable operation in harsh environments. Unlike plastic SIMs that can warp and fail, the eSIM component is soldered in like a standard electronic component to guarantee permanent electric contact. 

Designed to provide LTE global coverage, it provides a migration path for legacy 2G and 3G devices to 4G LTE global coverage.

U-Blox has also announced the Maya-W4 (www.u-blox.com/en/product/maya-w4-series), a tri-radio module with support for dual-band Wifi 6, Bluetooth Low Energy 5.4 and 802.15.4 for Thread supporting Matter. It suits IoT applications in diverse industries, enhancing device connectivity and interoperability.

Whether enabling low-energy mesh networks for smart homes or providing high-speed Wifi 6 connectivity for industrial tools, the Maya-W4 offers flexibility for developers and manufacturers. Its small size and robust design make it suitable for space-constrained applications, while its global certifications ensure seamless deployment across regions.

It alleviates network congestion, enhances power efficiency and, with a temperature range of -40 to +85˚C, is suitable for industrial environments. With its entry-level feature set and optimised data throughput, it is said to offer cost-efficient connectivity without compromising performance. The inclusion of 802.15.4 enables low-power IoT and mesh networking, providing a gateway for future smart, connected devices.

The module also eases design efforts, enabling manufacturers to scale their device designs for current and future markets. Offering a selection of antenna variants, designers can choose between pin(s) out, embedded antenna or U.FL. connector(s) configuration. By maintaining the same compact dimensions as its predecessors (10 by 14 by 1.9mm), it simplifies migration across previous generations.

“The U-Blox tri-radio Maya-W4 module integrates our newly announced NXP IW610 chipset to deliver the latest wireless connectivity technologies to additional segments such as industrial, medical and consumer,” said Larry Olivas, vice president at NXP (www.nxp.com). “We are excited about the Maya-W4 and U-Blox’s commitment to NXP as a strategic connectivity partner.”

Samples are available now, with volume production scheduled for the second half of 2025.

Headquartered in Thalwil, Switzerland, U-Blox (www.u-blox.com) has a global presence with 1400 employees.