Lantronix launches new IoT chipsets

  • February 2, 2023
  • William Payne

IoT chipset provider Lantronix has expanded its Open-Q family with new entry-level and mid-tier System-in-Package (SIP) modules, as well as a companion development kit. The chipsets are designed with advanced heterogeneous compute architectures.

The company’s new entry-level Open-Q 2290CS and mid-tier Open-Q 4290CS SIP chipset modules are accompanies by a companion Open-Q AL2 Development Kit. The two SIP modules are footprint compatible, allowing for flexibility in hardware design choice.

The SIP modules are based on the Qualcomm QCS2290 and QCS4290 System-on-Chip (SoC), utilizing Qualcomm Technologies’ heterogenous compute expertise with multiple specialized processing cores. The new Open-Q SIP modules deliver more powerful performance, vivid graphics, dynamic camera capabilities and a broad set of connectivity options.

“With the expansion of the Open-Q family, Lantronix continues to deliver powerful platforms for the development of IoT products that are supported by world-leading Qualcomm technology,” said Paul Pickle, CEO of Lantronix. “Our long-standing experience with Qualcomm Technologies enables us to deliver a wide variety of development solutions and support the quick and cost-effective delivery of innovative IoT and edge-computing solutions to market.”