Electronic components manufacturer KYOCERA AVX reports that demand for system-in-package (SiP) technologies is surging. KYOCERA AVX offers a variety of compact and high-performance internal, on-board, multiprotocol, 2.4GHz antennas designed for use in system-in-package (SiP) applications.

SiP modules feature a number of integrated circuits (ICs) with distinct functionalities in a single miniature chip carrier package and often include several silicon and passive components as well. They perform most of the functions of an electronic system, including processing, memory, and other specialised functions.

The continued growth of the 5G mobile and wearable device, high-performance computing (HPC), artificial intelligence (AI), Internet of Things (IoT), and autonomous vehicle industries is driving significant growth in the SiP market, which was valued at $15.36 billion in 2023 and is projected to more than double to $35.20 billion by 2031.

KYOCERA AVX has more than 395 antenna patents and 1,000 active and passive antenna products, has sold more than 4 billion antennas, and has collaborated on thousands of designs with customers at the forefront of their fields, including STMicroelectronics (ST), a global semiconductor leader that provides customers across the spectrum of electronics applications with technologies that enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things.

As an ST Authorised Partner, KYOCERA AVX collaborates with the ST engineering team on antenna validation and implementation projects intended to help ST customers overcome design challenges, simplify the design of end-to-end solutions, and accelerate development cycles. The companies’ most recent collaboration resulted in ST using one of KYOCERA AVX’s high-performance internal, on-board, Bluetooth and BLE antennas in its new STM32WBA5M SiP microcontroller (MCU) module, which was released to market in early May 2025.

“The KYOCERA AVX antenna engineering team was a key collaborator during the development of our new STM32WBA Series SiP MCU module,” said Sylvain Raynaud, Product Marketing and Business Development Manager, MDRF Group – GPAM Division, STMicroelectronics. “They supported the identification and implementation of a standard multiprotocol (Bluetooth, Zigbee, Thread, and Matter) 2.4GHz antenna that satisfies our miniaturisation, performance, emissions, compliance, and cost optimisation requirements. As a result, our new ultra-low-power, small-form-factor, 2.4GHz wireless module provides customers with a turnkey solution for achieving best-in-class RF performance with no RF expertise.”

“We’re proud to be a part of the ST Partner Program and grateful for the opportunities it provides to problem-solve and innovate with the ST engineering team in service of further enhancing their device connectivity performance and helping their customers shorten design cycles and expedite time-to-market,” said Carmen Redondo, Director of Global Marketing – Antennas at KYOCERA AVX.

KYOCERA AVX on-board, multiprotocol, 2.4GHz antennas are RoHS-compliant, packaged on tape and reel for automated pick and place assembly and include:

• 1001312 Wi-Fi/Bluetooth/Zigbee/Matter Ceramic Antenna. This linearly polarised ceramic antenna exhibits high efficiency (62%), 1.88dBi peak gain, and superior RF field containment in a miniature 2.0 x 1.2 x 0.55mm (L x W x H) SMT package that weighs 0.003g. It supports the 2,400–2,485MHz band in addition to a configuration for 6.0–8.5GHz for ultra-wideband (UWB) applications and is available in an A-Series automotive version (A1001312) as well.
• 9005868 2.4GHz Corner Chip Antenna. This linearly polarised chip antenna supports Wi-Fi, Bluetooth, Bluetooth Low Energy (BLE), Zigbee, WLAN, ISM, and Matter protocols and is especially designed for corner placement, unlike other chip antennas, which are typically designed to be placed towards the middle of the PCB edge. This makes it a valuable solution for applications with small PCBs.
• 9001978 Ultra-Small 2.4GHz Chip Antenna. This linearly polarised chip antenna is designed to deliver high functionality, versatility, and performance in small and thin design. It has one of the smallest profile SMT packages currently available on the market, measuring 1.00 x 0.55 x 0.40 (L x W x H) and weighing less than 0.001g, and supports 2,400–2,485MHz band protocols, including Bluetooth, Zigbee, and Matter, in addition to configurations for 6.0–8.5GHz for UWB and 2.4/5.0GHz dual-band Wi-Fi applications.