ST Microelectronics has introduced its first STM32-ready wireless IoT modules from its recent collaboration with Qualcomm.

For industrial and consumer IoT applications, the IoT modules leverage the STM32 ecosystem and Qualcomm’s wireless connectivity.

The first of these modules, the ST67W611M1, contains a Qualcomm QCC743 multiprotocol connectivity system-on-a-chip (SoC), pre-loaded with a Wifi 6, Bluetooth 5.3 qualified and Thread combo to integrate with any STM32 microcontroller (MCU) or microprocessor (MPU).

The module will support Matter over wifi for future-proof connectivity, making the STM32 portfolio seamlessly accessible to the Matter ecosystem. Aiding the system integration, the module also contains 4Mbyte flash for code and data storage, and a 40MHz crystal. There is an integrated PCB antenna or micro RF (uFL) connector for an external antenna.

“Our collaboration delivers multiple advantages for the large community that leverage the STM32 family in their embedded systems,” said Remi El-Ouazzane, president of Swiss firm STM’s RF products group. “Qualcomm’s expertise in highly influential and widely used wireless connectivity technologies is now at product developers’ fingertips and combines with the powerful software, tools, features and project acceleration offered by the STM32 development ecosystem.”

Rahul Patel, group general manager at Qualcomm (www.qualcomm.com), added: “This is just the beginning of our mission, which we expect to deliver many further successes enabling new and advanced edge processing applications. We look forward to continuing our collaboration with ST Microelectronics to bring more unparalleled connected experiences with wifi, Bluetooth, AI, 5G and more.”

Hardware security is built in, with hardware cryptographic accelerators, as well as services including secure boot and secure debug, reaching PSA Certified level-one protection. The module is self-contained and pre-certified according to mandatory specifications, requiring no RF design expertise from the user to create a working product. Integrated in a 32-lead LGA package, it is ready to place on the board and permits simple, low-cost PCB designs with as few as two layers.

The ST67W611M1 (www.st.com/st67w) leverages the STM32 ecosystem, which contains more than 4000 commercial part numbers, STM32 Cube tools and software, and enhancements that boost edge AI development. AI enhancements include the recently introduced STM32N6 MCUs, which contain STM’s Neural-Art accelerator and edge AI suite that provides AI Model Zoo, STM32 Cube AI and NanoEdge AI optimisation tools.

The modules are designed to be quickly and seamlessly integrated with any STM32 MCU or MPU. The MCUs available range from cost- and power-sensitive devices containing the Arm Cortex-M0+ core to devices containing high performing cores such as Cortex-M4 and Cortex-A7 in the STM32MP1/2 MPUs.

Samples of the ST67W611M1 are available, with OEM availability early next year, and broader availability in Q2 2025.