Fibocom launches 5G module at Broadband World Forum

  • October 19, 2022
  • Steve Rogerson

Fibocom announced the global launch of its FG370 5G module at this week’s Broadband World Forum in Amsterdam.

Powered by the newly-launched MediaTek T830, the FG370 is set to bring enhanced mobile broadband, low latency and reliable 5G fixed wireless access (FWA) connectivity for global operators.

Compliant with 3GPP Release 16 (R16) standards, the 5G sub-6GHz module enables 5G speed experience with up to 7.01Gbit/s on the downlink and 2.5Gbit/s on the uplink theoretically.

Coming with a quad-core Arm Cortex-A55 CPU, it supports 4CC CA (carrier aggregation) and up to 300MHz of spectrum, as well as 2CC CA and up to 200MHz of spectrum, which improves the use of spectrum resources and ensures an extended 5G coverage. Supporting 5G standalone network (SA) and non-standalone (NSA) network architectures, the module is also backwards compatible with LTE-TDD, LTE-FDD and WCDMA network standards.

In addition, it supports 8RX (receive antennas), enhancing downlink speed, spectral efficiency and coverage quality. The module also supports Power Class 1.5 (PC1.5) high-power user equipment (HPUE), which allows a maximum transmit power of up to 29dBm, 6dB higher than that of PC3, and 3dB higher than that of PC2, increasing uplink speed and extending uplink coverage. With enhancements in terms of uplink and downlink speed and coverage, it can provide a better user experience while offering seamless 5G connectivity for FWA.

Connectivity includes dual-band 2×2 Wifi 7 for Mifi (BE6500) and tri-band 4×4 Wifi 7 for CPE (BE19000). These feature Wifi 7 capabilities such as 160MHz/320MHz bandwidth, 6GHz frequency band, 4096 QAM, as well as multi-link operation (MLO). The module also supports wired network deployment, allowing maximum 10Gbit Ethernet.

Interfaces include 10GbE USXGMII, PCI-Express, USB 3.2, and PCM/SPI for connection to external SLIC for RJ11 phone ports. It seamlessly enables a wide range of IoT applications, providing a high-speed 5G experience. The module also integrates MediaTek’s 5G UltraSave technologies to optimise energy efficiency for 5G connections, especially 5G Mifi.

“Fibocom is pleased to work with MediaTek to contribute to the proliferation of 5G,” said Simon Tao, general manager at Fibocom. “We’re delighted to introduce the new generation of 5G module FG370 to the global FWA market, further boosting 5G commercialisation with enhanced coverage, increasing throughput as well as optimised capacity.”