VIA launches ruggedised edge system for IIoT

  • November 29, 2022
  • William Payne

Taiwanese industrial technology developer VIA Technologies has launched a ruggedised edge system for Industrial IoT use cases. The VIA AMOS-3007 is designed for manufacturing applications such as equipment monitoring, process automation, rich data visualisation, and facilities management.

The system is powered by a fanless 1.5GHz Intel Atom quad core processor in a ruggedised compact enclosure measuring 70mm (W) x 48.5mm (H) x 126mm (D). It has an operating temperature range of -20°C to 70°C. It includes two Gigabit Ethernet ports, two lockable USB 2.0 and two USB 3.0 ports, two HDMI connectors supporting dual display, two COM ports, and one DIO port for 8-bit GPIO. Internal expansion options including three M.2 slots for SATA storage and wireless expansion models, one 4G/5G SIM card slot, and one DDR4 SODIMM slot that supports up to 32GB of memory.

“The VIA AMOS-3007 provides the complete package of high performance, low power, and rich I/O connectivity required for the most demanding IIoT use cases,” said Richard Brown, VP of International Marketing, VIA Technologies, Inc. “With its ruggedised design and support for a wide operating temperature range, this robust, ultra-compact system delivers rock-solid reliability in the toughest operating environments.”