Proving the Business Case for the Internet of Things

Deutsche Telekom moves IoT SIM functions to chipset

Steve Rogerson
February 7, 2019



Deutsche Telekom says it is improving its European and US IoT service offering with NuSIM, which moves the SIM functionality from the physical SIM card directly to the chipset. Partners in developing the product include Qualcomm, Samsung, Sierra Wireless, Telit and U-Blox.
 
NuSIM is designed for low-cost devices used in mobile IoT applications with a long life-span, such as asset trackers or smart motion or temperature sensors. It will be commercially available in the second half of 2019.
 
“Deutsche Telekom has built a solid track record in IoT technology innovation over the past years,” said Ingo Hofacker, senior vice president at Deutsche Telekom. “The most important success driver for us is to anticipate customer needs to make sure we enable their business success. NuSIM, our rigorously optimised SIM solution for the cost-sensitive mobile IoT market, is our latest endeavour and an important building block for our offering moving forward.”
 
The elimination of the physical SIM card simplifies the form factor of an IoT device as there are no additional contacts, circuit paths or SIM card holders to consider. NuSIM provides a small hardware and software footprint for cost-efficient implementations with low power consumption.
 
This brings simplicity as well as cost and time savings along the IoT value chain. Device vendors benefit from better design options due to smaller package size and extended battery life. SIM logistics, such as stock keeping or handling, are no longer necessary. IoT service providers can save costs through a simple digital process that puts the operator's credentials onto the device during manufacturing time. Users also benefit from the lower device cost. In addition, they can start their mobile IoT project quicker and easier since a fully operational SIM is already on board.
 
Deutsche Telekom has partnered with companies in the fields of IoT chipsets, modules and digital security to cooperate on NuSIM. An open specification set ensures interoperability for the secure provisioning of operator credentials during module or device production. The partners include: 

  • Chipsets: Altair Semiconductor, Commsolid/Goodix, HiSilicon, Nordic Semiconductor, Qualcomm Technologies, Samsung Electronics and Sequans Communications.
  • Modules: Quectel Wireless, Sierra Wireless, Telit and U-Blox.
  • Digital security: Giesecke+Devrient Mobile Security.
Deutsche Telekom is ready to share the technology with other operators and vendors in the IoT segment to establish a viable ecosystem.
 
NuSIM will be on show at this month’s Mobile World Congress in Barcelona.