Proving the Business Case for the Internet of Things

IoT Software Backbone Integration for IoT Platforms

November 7, 2019
11am ET

Sponsored by:

Integrating IoT deployments with backbone systems for ERP and CRM is empowering for factory-floor and supply-chain managers, as well as service organizations. Benefits range from predictive maintenance to automated use of social data. This session will highlight practical advice about getting connected, avoiding expensive integration programming, making intelligent choices about data, and of course, security.


Speakers:

Syed Zaeem Hosain, Chief Technical Officer, Aeris
Mr. Hosain is responsible for the architecture and future direction of Aeris’ networks and technology strategy. He joined Aeris in 1996 as Vice President, Engineering and is a member of the founding executive team of Aeris. Mr. Hosain has more than 38 years of experience in the semiconductor, computer, and telecommunications industries, including product development, architecture design, and technical management. Prior to joining Aeris, he held senior engineering and management positions at Analog Devices, Cypress Semiconductor, CAD National, and ESS Technology. Mr. Hosain is Chairman of the International Forum on ANSI‐41 Standards Technology (IFAST) and Chairman Emeritus of the IoT M2M Council (IMC). He holds a Bachelor of Science degree in Computer Science and Engineering from the Massachusetts Institute of Technology, Cambridge, MAA
 


Fred Yentz, President Strategic Partnerships, Telit
Fred Yentz is currently the President of Strategic Partners at Telit. Fred joined ILS Technology, a Telit company, as senior vice president and chief operating officer in January 2007, bringing with him more than 20 years industry experience in the technology solution market. Prior to ILS Technology, Fred Yentz served as Vice President and General Manager of RadiSys Corporation, a leading provider of embedded solutions for the telecommunications, enterprise data, medical equipment and the industrial automation marketplaces. While at RadiSys Corporation, Fred served in many capacities including the oversight of World Wide Sales, Marketing, Professional Service, and Business Development in addition to General Manager of Enterprise, Communication and Commercial operating divisions. Fred also worked for IBM where he held various positions with responsibility for Engineering, New Business Development and Management.
Mr. Yentz is named as an inventor on two U.S. patents and has received IBM's First Level Plateau Invention Achievement Award. He currently serves on the Board of Directors of the Telecommunications Industry Association (TIA), National Science and Technology Education Program (NSTEP), and is chairman of the Industry Advisory Board for Florida Atlantic University's College of Engineering. Mr. Yentz holds a Bachelor of Science in Electrical Engineering from Michigan Technological University (1988), a Master of Business Administration (1996) from the University of Miami, and a Master of Science in Computer Information Systems (1997) from the University of Miami.